The semiconductor industry is entering a defining era—where advanced architectures, AI‑driven computing, next‑generation materials, heterogeneous integration, photonics, quantum technologies, and intelligent manufacturing are converging to redefine what chips can achieve.
SEMI‑X 2027 brings together researchers, engineers, technology leaders, innovators, manufacturers, academics, and emerging companies to explore the ideas and technologies driving this transformation.
From next‑generation transistors and AI accelerators to chiplets, advanced packaging, HBM, silicon photonics, quantum devices, and intelligent fabs, the conference creates a global platform for sharing breakthroughs, building collaborations, and translating research into technological impact.
Semiconductor innovation no longer happens in isolation.
SEMI‑X 2027 explores the complete technology journey—from materials and device architectures to chip design, fabrication, packaging, system integration, and intelligent applications.
Explore the technologies shaping the next generation of semiconductor systems.
Connect with scientists, engineers, academics, industry experts, and technology innovators.
Discover advances across AI hardware, chiplets, 2.5D/3D integration, photonics, quantum semiconductors, emerging materials, and more.
Move beyond discovery toward scalable technologies, industrial applications, and commercialization.
Explore how semiconductor innovation is transforming AI, communications, computing, sensing, energy, healthcare, and advanced manufacturing.
The conference is designed not simply as a place to present research, but as a platform where ideas meet expertise, research meets industry, and innovation meets opportunity.
Share original research, emerging technologies, and technical breakthroughs.
Build meaningful relationships with researchers, engineers, companies, and technology leaders.
Stay ahead of developments transforming semiconductor engineering and electronics.
Identify new research partnerships, industrial collaborations, and commercialization opportunities.
Professors, researchers, scientists, postdoctoral researchers, and students.
Chip designers, process engineers, packaging specialists, equipment manufacturers, and technology developers.
R&D leaders, CTOs, engineering managers, architects, and innovation teams.
Startups, entrepreneurs, technology founders, and companies developing next‑generation semiconductor solutions.
Policy leaders, research organizations, funding agencies, and semiconductor ecosystem stakeholders.